Brunel Engineering Services Ltd
TEL: 01225 784019

Peel and Seal System

Product Description

The BES Peel and Seal System

Based and expanded from our successful Tape Applicators, the Peel and Seal System applies Slot Coated Pressure Sensitive glue to the product and then applies a plain siliconised paper to that glue line.

Fronting up the system is our own long standing and successful, MK5 Hotmelt Slot Coat Gun, whose long track record lies with the application of Remoist Hotmelts. The MK5 glue gun is supplied from a UES Hotmelt System. However, the MK5 can be configured for supply from your existing hotmelt tank, e.g. Robatech®
The glue line width is usually narrower than the tape, so as to provide a complete cover to the glue and a finger facility

Following glue application to the base product, plain siliconised paper tape is applied precisely to cover the glue.
The tape applicator head is supplied from a separate tape loop generator which replenishes itself automatically.

Tape real size up to 450mm diameter, typically 18-25mm wide, with a 3" core

Like our Tape Applicators, the system can be run at linear speeds of up to 40mtrs/min

Intended for board envelope sealing, typically using corrugated board

The Peel and Seal system requires mounting to a transport device. We can provide such a device or it is likely that the equipment can be retrofitted a carton-folder-gluer. Our engineers are available to visit and assess your own transport device

Peel and Seal System


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The Street
Broughton Gifford
Melksham
Wiltshire
SN12 8PH
United Kingdom
t: 01225 784019
e: general@brunelengineeringservices.co.uk